DS (Display & Solar)
Product details
Structure
- Release Film
- UV PSA
- Base PET
Feature
- It can be used to Dicing purpose for LED Wafer / Semiconductor Wafer / PCB/ceramic
- Based on the acrylic adhesive, it is possible to fix the wafer or the substrate with high adhesive force
- Prevent contamination due to foreign material inflow
- After UV irradiation can be removed neatly
- There is no adhesive bur after dicing
- Have high heat resistance
Product
* Check this product details by swiping.
| Item | Unit | HTD125SS | |
|---|---|---|---|
| Thickness | ㎛ | 125 | |
| Peel Strength | gf/inch | Befor UV | 1000 |
| After UV | Less than 30 | ||
EG Chem
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